According to Anandtech, TSMC seems to be developing both 3nm and 2nm at the same time. Unsurprisingly, the Taiwanese foundry isn’t sharing a lot of detail, only that development for the die lithography is progressing nicely under its “advanced CMOS logic”. As for its 3nm and 4nm process, Anandtech says that both process nodes are still on track with its development, with 4nm expected to enter mass production by early 2022, while the 3nm – part of the company’s N3 roadmap – should enter risk production this year, with mass production expected to begin during the second half of 2022. TSMC has long dominated the semiconductor market and has virtually cornered half the market, the other half having been bagged by Samsung. Earlier this month, the company also announced that it would spend US$100 billion (~RM410 billion) over the next three years to ramp up its production capacity. (Source: Anandtech)
